Samsung chip chief meets Nvidia CEO to discuss next-gen HBM cooperation

Jun Young-hyun, head of Samsung Electronics' device solutions division, met Monday with Nvidia CEO Jensen Huang in South Korea to discuss long-term cooperation on next-generation high-bandwidth memory chips, the Korea Times reported.

The meeting signals Samsung's push to challenge SK hynix for a larger share of Nvidia's memory supply chain as AI data center expansion drives unprecedented demand for advanced HBM chips.

Huang traveled to South Korea to explore cooperation opportunities across the AI ecosystem, according to the Korea Times. His meeting with Jun covered next-generation HBM roadmaps including HBM4E and HBM5 technologies as well as potential foundry collaboration.

Samsung committed to prioritizing near-term supply of HBM4 chips to Nvidia, the Korea Times reported.

"We have maintained cooperation with CEO Huang for a long period, and we have had very productive discussions so far," Jun said after the meeting, according to the Korea Times.

HBM chips are advanced memory semiconductors that deliver the memory bandwidth required for AI training and inference. Demand has accelerated sharply as data centers expand capacity for powerful AI models.

When asked about Huang's earlier remark that SK hynix will remain Nvidia's biggest memory partner, Jun said Samsung would "work hard on what we do," according to the Korea Times. Nvidia holds a dominant share of the global AI accelerator market.

Samsung's bid to deepen its Nvidia partnership comes as HBM demand — driven by the rapid expansion of AI data centers and the deployment of increasingly capable AI models — continues to reshape priorities across the global memory industry, according to the Korea Times.